eTeknix » thermaltake

Thermaltake Tt eSport Battle Dragon LAN Bag Review

Tim Mammatt — Wed, 25 Jan 2012 12:17:02 +0000

The Thermaltake Tt eSports brand is renowned for its gaming peripherals, from keyboards to headsets – and even gaming gloves! “Challenge is the Game” is Tt eSports motto, which reiterates their philosophy of gaming to the extreme. They’ve introduced world firsts such as the Challenger keyboard, which features the first-of-its kind integrated fan to keep your hands cool.

Tt eSports sponsor many professional gaming teams around the globe, so they know exactly what is required when it comes to gaming peripherals and thus produce top quality products that meet the demands.

An often overlooked area when it comes to gaming, is gaming events, from small LAN parties with friends, all the way up to world championships. Whilst overlooked, it is becoming increasingly popular for hardware manufacturers to address issues that often come up at these events. Brands such as BitFenix have incorporated carrying handles into some of their cases to aid transportation of gaming rigs for BYOC (Bring Your Own Computer) events.

What will be reviewed today, is an unusual product, that whilst simple in concept, is clever in execution; what we have, is the Thermaltake Tt eSports Battle Dragon LAN Bag.

At an initial glance the Battle Dragon Bag looks like an over-sized laptop bag, that could take a whopping 24” laptop if such a laptop existed. The bag matches Tt eSports colour scheme with a black exterior, and red detailing interior. Featured on the outside pockets of the bag is a large red dragon and Tt eSports logo.

The bag also features three main compartments on the outside; two large pockets and a third pocket that covers the whole side – this one is explained in more detail in the next paragraph. The two large pockets then have another zip compartment on them – adding yet even more storage space.

One of the ways this bag can be carried is like that of a carry case, with just one handle on the top of the bag, however, there are also two other ways to carry this bag. Stored in one of the side pockets is a shoulder strap that turns it into a messenger style bag. In addition to this way, there is also a very useful feature that is hidden in the large side panel. After almost completely unzipping the side panel, (which then rolls up) reveals two shoulder straps – so now you have a rucksack. The panel neatly rolls up and fastens down to the Velcro on the now, top end of the bag. Carrying the bag this way, means you can keep you arms free to carry any additional items like your PC.

Throughout the bag there is ample padding, which not only provides cushioning for your back when in rucksack mode, but also protects the many delicate electronic items that might be in the bag.

The interior is split into five main sections, 2x large pockets and 3x small pockets. The larger of them can contain items like monitors, whilst the smaller ones, things like mice, keyboards and the monitor’s stand.

Due to the bags large size, it is possible to fit a 24” monitor in it, with adequate protection, on top of all the other items that you may want to fit in there – and that could be a lot.

Upon testing, it was possible to fit a Dell U2301h 24” monitor, a full size keyboard, a mouse, a mousemat, speakers, tools, and an ipad and still have loads of room left over; making this bag perfect for those LAN parties. When fully loaded it is recommended using the rucksack shoulder straps as it can get fairly uncomfortable using the messenger strap.

There is also plenty of padding between your back and the contents of the bag meaning no sharp corners digging into you.

LAN bags are not a common accessory when it comes to PC peripherals so it’s good to see one of the major gaming brands start to open up this area and with no doubt other brands will catch on, as BYOC gaming events become more popular. Here Tt eSports have created a superb bag that can hold nearly everything except from the kitchen sink. Coupled with plenty of padding and numerous different carrying methods to suit the individual, this bag is ideal for any and all LAN party lovers. Just having the additional rucksack shoulder straps, that unfold from a side pocket really makes it easier when transporting all your gear around and keeps it protected at the same time.

Being one of the first LAN bags eTeknix has had to review, it has set a high precedence, where we shall look forward to seeing what other brands have to offer in the future. So due to all the positivity of this great LAN bag, we are awarding it with the following ‘Gamers Choice Award’.

Thermaltake give Frio CPU coolers the ‘Snow’ treatment at CES

Ryan Martin — Thu, 12 Jan 2012 15:05:51 +0000

Thermaltake has been giving its Frio CPU coolers the snow edition treatment for their showcasing at CES 2012. After the success of the Level 10 GT Snow Edition PC case it made sense for Thermaltake to do the same for its CPU coolers for those looking to coordinate a white case with white components. The two ‘lucky’ CPU coolers to get the treatment are the Thermaltake Frio and the Frio OCK.

The Frio Snow Edition

Uses the same exact design as the original version, but replaces the black+red plastic parts of it with white+blue, including a white colored fan impeller. It is a typical aluminum fin tower-type heatsink with two pre-fitted 120 mm fans in push-pull configuration. It measures 139 x 98 x 165 mm (LxWxH), weighing a little over 1 kg. Another feature of this cooler is out-of-the-box support for socket LGA2011.

The Frio OCK Snow Edition

As a variant, its specifications are otherwise identical to the original, except that the black+red colored plastic parts (such as shrouds, fan frames, and impellers), are replaced with white+blue colored ones. The blue, of course, is an “icy” shade of it. The top shroud is black, to offer a nice contrast with the white+blue colored fan frame. Measuring 143 x 136.8 x 158.4 mm (LxWxH), the cooler weighs about 1.1 kg. It uses a slightly larger heatsink than the one found on the Frio, to which heat is conveyed by six 6 mm-thick heat pipes. The heatsink is ventilated by two 130 mm fans in “push-pull” configuration. The new variant also provides out-of-the-box support for LGA2011 socket.

Source: TPU

Thermaltake pairs up with BMW’s Designworks once more

Gaetan Longree — Mon, 09 Jan 2012 18:19:30 +0000

CES 2012 starts tomorrow, although it hasn’t stopped companies from giving a preview to some reporters. Tom’s Hardware has had the chance to see exclusively a new product from Thermaltake, or rather it’s subdivision, Tt eSports.

Once again, a partnership with BMW’s Designworks USA is taking place, however it is not a new case that comes out of it, but rather a new mouse; the Level 10 M mouse.

As you can see by the picture, this mouse presents a rather unique design, but so did the Level 10 cases. A hollowed-out design takes place here, this feature allows for both height and angle adjustment of the mouse’s body.

By turning a screw on the top side of the mouse, the user will be able to adjust the size and shape of the mouse to fit best the style and allow for better gameplay.

In order to give some more comfort in long playing sessions, the palm surface is perforated to give a passive airflow.

Release date and price haven’t been given, but more will be given out during the week.

Source

Tt eSports debut new Pyrrhus gaming mousepads

Ryan Martin — Tue, 03 Jan 2012 18:26:25 +0000

The Tt eSports team at Thermaltake have come out with a new mousepad line named Pyrrhus. The mousepads will come in three different sizes for gamers who have different space requirements:

440mm by 350mm
360mm by 300mm
280mm by 210mm

The pads are very thin at just 2mm but feature a rubberised base for strong grip and a synthetic fiber material on top that’s easy to clean (can be hand-washed) and enables precise tracking for all types of sensors.

The mousepads have initially been listed in Taiwan already but should go on sale across the rest of the world shortly.

Thermaltake Frio Advanced CPU Cooler Review

Luke Hill — Mon, 26 Dec 2011 11:04:34 +0000

When Thermaltake released their Frio a short while ago, much of the enthusiast market were somewhat surprised by the class-leading performance on offer. The single tower CPU cooler managed to show excellent cooling potential that put it ahead of a large proportion of the single tower cooling market and even some of the dual tower market. Since then though, there has been a lot of change. More high performance CPU coolers have been released from the likes of Phanteks with their PH-TC14PE, Corsair and Antec with their all-in-one liquid cooling units and even Thermaltake with their own upgrade to the original Frio, the Frio OCK. Today’s sample, the Thermaltake Frio Advanced, definitely has some tough competition.

As the name suggests, Thermaltake have kept some of the cooler’s fundamentals the same. Changes come in the form of 5 6mm copper heatpipes in a H.D.T. design, a slightly revamped aesthetic design and a different pair of fans. The 130mm fans that Thermaltake choose to use are capable of up to 2000 RPM and use the very convenient 4-pin PWM connection. 2 high powered fans coupled with a dense aluminium fin array should make for excellent heat dissipation potential. The benefits of the H.D.T. design base’s heat transfer rate should become evident when used in conjunction with the aforementioned heat dissipation features. Let’s hope that our hot Core i7 2600K doesn’t saturate the claimed 230W heat extraction limit of those 5 copper heatpipes.

Thermaltake have designed their Frio Advanced to support all modern Intel and AMD sockets including the brand new LGA 2011. Priced at a very appealing £50/€50, the Thermaltake Frio Advanced could be a huge success in the budget conscious enthusiast market. So, without further ado, let’s put the Frio Advanced through our barrage of demanding tests and see if it can handle our extreme 4.7GHz overclock test which only the best few coolers are able to complete.

Thermaltake unveil the MS-I snow edition

Ryan Martin — Wed, 30 Nov 2011 12:43:10 +0000

Thermaltake, the leader and pioneer brand in PC thermal solutions, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, with “delivering the perfect user experiences” as our mission. This winter, Thermaltake has prepared Commander MS-I Snow Edition to take on a gratitude mission of thanking our fans for the support throughout the year of 2011 as well as with a new suit to blend into the snowy battlefield for e-Sports enthusiasts.

Thermaltake Commander MS-I Snow Edition
Thermaltake Commander MS-I has made a huge blast since its first present in July 2011. This winter, with its determination and consistency, Commander MS-I is suited up with a brand-new snow look to move its way through a snowy battlefield. The Commander MS-I Snow Edition is equipped with extra-long VGA support which will hold some premium weapons (graphic cards) in the market, such as nVidia GTX590 and AMD Radeon HD6990 with ease, cable management and 12cm blue LED fan to enhance air mobility (ventilation), USB2.0 and USB 3.0(internal 19pin) front I/O slots allow direct data transfers during combat situation, and 9 drive bays grant with maximum magazine (HDD, optical drives) storability so you will never run out of resources.

For more information, visit the product page.

Source: Press Release

New Contac 39 and 30 CPU coolers from Thermaltake

Ryan Martin — Mon, 31 Oct 2011 10:17:24 +0000

Thermaltake, being the industry pioneer brand in thermal solutions with the mission of “delivering the perfect user experience,” carrying the corporate vision of “building Thermaltake Technology into a cultural brand for the enjoyment of entertainment, e-Sports, technology, and lifestyle,” featured the Contac CPU air cooling Series that aids in fulfilling various needs in the market as well as the corporate mission of “delivering the perfect user experience.” This fall adding the shimmering Thermaltake Contac 39 and Contac 30 CPU air cooling to the series, providing a wider range of solution for bargain hunter who desire value and performance equally.

The shimmering Contac 39 and Contac 30 materialized with dual and single crystal clear blue LED fans presented the blare while it performance, as well as improved curved aluminum fins of heat sink that not only reduce back air resistance but also grant for a better heat dissipation while heat been transferred from the CPU to the heat sink. Moreover, the new designed multifunctional surface-mount with back-plate will support all Intel and AMD chipsets as well as the latest Intel Sandy Bridge-E Socket LGA-2011.

Prosperity of Performance
The Contac 39 and Contac 30 are exactly what the name suggested; a direct touch technology with three 8mm Æ heat pipes is inherited along with special design low noise 120mm PWM fans that automatically adjust the fans’ speed between 800~2000 RPM according to the system condition to grant for a more direct and smart heat dissipation. The fans are connected with anti-vibration soft mounts allow easy access for installation and removal of cleaning as well as decrease the noise while the fans operate.

For more information, visit the product pages of Contac 39 and Contac 30.

Source: Press Release

Thermaltake releases the Frio Advanced CPU cooler

Ryan Martin — Mon, 24 Oct 2011 16:32:30 +0000

Thermaltake, the leader and pioneer in PC thermal solutions, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, with “delivering the perfect user experiences” as our mission and carrying the corporate vision of “building Thermaltake Technology into a cultural brand for the enjoyment of entertainment, e-Sports, technology and lifestyle.” This October, featuring the Thermaltake Frio Advanced CPU cooler – a CPU cooler that incorporated some of the most up-to-date CPU cooler technologies and persevered the greatnesses from its predecessors of Frio and Frio OCK which not only creating a new phenomenon for overclockers but also set another signature for the Frio Series.

State-Of-The-Art Technology
Unlike the traditional welding between the heat-pipe with the heat-sink which created extra welding points acting as heat collectors on the heat-sink, the Thermaltake Frio Advanced consolidated the most up-to-dated CPU cooler technology using mechanical assembling on the heat-pipe with the heat-sink which provides a precise and direct contact for flawless heat transmission from the CPU to the heat-sink.

Plus, the 5 x Ø6 mm heat-pipes with direct touch to the CPU surface and high density aluminum fins allow larger surface area that not only increased heat conductivity but also grant for a better heat dissipation. Moreover, the Thermaltake has also incorporated the Pulse-width modulation (PWM) technique to control the speed of the Frio Advanced’s dual 13cm fans from 800~2000 RPM in favor of a smarter fan noise management for overclockers.

The Thermaltake Frio Advanced CPU cooler has preserved some of the great functionalities from its predecessors of Frio and Frio OCK like the dual 13cm over-clocking of high performance red bladed fans which generate excellent cooling power, tool-less fan installation provides great convenience, vibration-absorbent gaskets decrease noise during operation and all-in-one back-plate design that support the up to latest Intel LGA 2011 and all AMD platforms for overclockers. The Frio Advanced CPU cooler is one true CPU air cooler which support up to 230w that Thermaltake could offer to the overclock enthusiasts.

Heat-pipe Direct Touch Technology:

5 x Ø6mm heat-pipes directly touch CPU
Dual 13cm Over-clocking Fan: Dual high performance fans generate excellent cooling power
Tool-less fan installation: Tool-less design for fan installation
All-in-one back-plate design: Universal sockets support up to latest Intel LGA 2011 and all AMD platforms

For more information, visit the product page.

Source: Press Release

Thermaltake follow Noctua and offer free LGA 2011 mounting kits to existing customers

Ryan Martin — Mon, 24 Oct 2011 12:25:42 +0000

The process and anticipation of upgrading to the latest processor has always been some of the most exciting times for every PC enthusiast. But along with the excitement, users are often faced with various decisions such as which motherboard to get, is a memory upgrade needed or will a new CPU cooler have to be purchased? While Thermaltake cannot make most of those decisions for you, if you currently own or are planning to purchase any of the following Thermaltake performance coolers listed below, you will be in good hands. In order to better serve our customers, Thermaltake is proud to announce the Thermaltake FreeUp Program.

The upcoming Intel Sandy Bridge-E processors will be based on socket LGA-2011 as evident from the recent Intel Developer Forum (IDF) conference. Thermaltake is here to ensure that our current and future customers of Thermaltake cooling solutions will have access to the newest technology without the hassle of trying to mock up new mounting or purchasing a new cooler entirely. The LGA-2011 upgrade mounting hardware will be provided free of charge to anyone who has purchased a qualified cooler on or after September 1st 2011. Thermaltake will be incorporating the new LGA-2011 kit into all LGA-2011 compatible coolers in both retail and e-tail space once the Intel Sandy Bridge-E processor launch is confirmed, but this program is to ensure that anyone who supports Thermaltake brands by choosing the qualified cooler as their solution will have the LGA 2011 mounting available to them when they make their purchase or in the case that the cooler may have been in store before the changeover. Thermaltake wants to ensure you can upgrade and use your recently purchased cooler with no worries about future compatibility.

For those who have purchased a LGA 2011 qualified coolers prior to September 1st, 2011 and are planning on upgrading, Thermaltake will also be making the LGA-2011 kit available for purchase separately. This will ensure that no matter the timeframe, anyone can upgrade to the newest platform with a minimum amount of hassle.

Among various physical attribute changes, the most notable difference is that there are no “pass-through” holes for the mounting mechanism. On the LGA-1155/1156 and LGA-1366 motherboard, the mounting retention would pass through the motherboard and be retained by either plastic push pins or a variation of backplate and mounting screw combination depending upon the cooler used. With the LGA-2011 socket, the main load mechanism to retain the CPU in the socket also has threaded tabs which are where the cooler will be mounted. This will require a change to present cooler mounting for compatibility and Thermaltake has a solution to ensure you can upgrade to this socket with just a minor hardware change.

Intel LGA-2011 compatible coolers:

Thermaltake Bigwater 760 Plus
Thermaltake Frio OCK
Thermaltake Frio
Thermaltake Contac 30

To claim your free LGA-2011 mounting upgrade kit:

To apply, please visit this page
Submit required information to claim your mounting hardware kit

Terms and Conditions for the Thermaltake FreeUp Program:

FreeUp product will be shipped shortly after launch of the LGA 2011 processor
FreeUp eligibility requires proof of purchase of:

a. Qualified Thermaltake LGA 2011 compatible cooling solution

b. LGA-2011 compatible motherboard or processor

FreeUp product can take up to 2 weeks for shipping depending upon location
Qualified Thermaltake product must be purchased on or after September 1st 2011 to qualify for the FreeUp program
The Thermaltake FreeUp Program is only available for customers in North America.

Source: Press Release

Thermaltake Level 10 GT Snow Edition Chassis Review

Luke Hill — Sun, 23 Oct 2011 23:03:15 +0000

There is vast selection of cases which tend to the needs of the average user, gamer and enthusiast. Looking at the sub £150 market, we can see well over 25 cases that are worthy of recommendation at a specific price point for a specific user’s needs. While these cases are excellent in their own respect, what happens when an extreme enthusiast wants the very best that money can buy? Maybe Thermaltake can answer that question.

The Level 10 series have always been at the pinnacle of Thermaltake’s case line-up with the original Level 10 holding the $799.99 top spot. Thermaltake realised the somewhat restrained interest in such an expensive case though and decided to offer a more ‘affordable’ version which managed to keep the up-market feel and premier design; the Level 10 GT. Coming hot off the back of numerous awards including our own eTeknix gold, the Level 10 GT sees a new sibling, the Level 10 GT Snow Edition.

As you may have anticipated, the snow edition is mainly white on the exterior and shares the same aesthetic appeal and design as its brother. The changes aren’t entirely cosmetic though. An internal USB 3.0 header makes a hugely welcomed arrival on the snow edition. The migration to more of a blue lighting theme is an excellent decision by Thermaltake’s design team, allowing a smooth arctic white and subtle blue appearance. Fundamental features which set the Level 10 GT apart from the chasing pack haven’t been changed meaning that you won’t have to make the compromise between a more fitting style or better performance, Thermaltake’s Level 10 GT Snow Edition has everything that its predecessor did and more.

We have explained the background and features to the £215/$270 Level 10 GT Snow Edition, so without further ado, let’s head on into the main review.

Thermaltake debut the Transporter Carry Bag

Neil Brett — Tue, 11 Oct 2011 18:45:55 +0000

Thermaltake have announced the release of the Transporter Carry Bag aimed at those users that require a bag for their tower to enable easy handling and storage to LAN events and offers support for most full tower design chassis, also protecting against all possible weather conditions, the bag also features ample storage for peripherals in a very sturdy design.

Rain/Dust/Snow resistant to ensure your hardware travels safely and with style
Designed to fit even the largest gaming chassis including the Level 10 GT
Store your peripherals such as your keyboard, mouse & headset
Holds up to 100kg/220lb so no matter how extreme the rig, we can handle it
Red/Black styling to give an aggressive look while offering the storage you need

The Transporter is constructed from black 600D polyester with red accents and has dimensions of 600mm x 300mm x 600mm, supporting a chassis weigh of 100kg / 220lbs, the pocket dimensions are 300mm x 30mm x 600mm for the larger devices and a small pocket of 300mm x 30mm x 230mm on either side of the carrying bag.

As of writing there aren’t any pricing details.

Thermaltake’s newest chassis the V3 BlacX Edition

Neil Brett — Thu, 06 Oct 2011 15:32:02 +0000

Thermaltake welcomes the newest member of the V series family – the aesthetic V3 BlacX Edition chassis, this newest incarnation of the V3 features 3x 5.25 inch drive bays, 1x 3.5 inch bay, a top mounted external 2.5/3.5 inch HDD docking bay, internal drive bays for 4x 3.5 inch and 1x 2.5 inch.

The cooling features support for up to 4 fans but only comes with the rear exhaust as standard 120 x 120 x 25 mm Blue LED fan, 1000rpm, 16dBA with optional support for 120 x 120 x 25 mm as the front and bottom intake and another for top exhaust, case dimensions are D473.0 x W190.0 x H445.6 mm (18.6 x 7.5 x 17.5 inch) and has 7 expansion slots.

The ports on the case are 1x USB 2.0, 1x USB 3.0 (but is an external connection and microphone and audio ports, being of a mid-tower design it can handle Micro ATX and Standard ATX motherboards, maximum graphics card length is 263mm and a maximum cooler height of 160mm, the PSU mount is at the bottom with an included dust filter.

The chassis also sports a black interior and exterior finish and weighs in at 4.8 kg (10.6 lb), a closer look at the case can be seen on the product page here.

Thermaltake Armor A30 Micro ATX Case Review

Henry Butt — Tue, 27 Sep 2011 08:39:10 +0000

There is an ever increasing market for small form factor cases as consumers demand smaller PCs to fulfil their space requirements. Small form factor cases are perfect for people who want to build a home theatre PC or even for people who don’t have a lot of space to work with.

Thermaltake produce a wide range of products that includes some quality power supplies and a variety of gaming peripherals under their Tt eSPORTS brand. But one of their key areas of expertise is in the PC case market. While they have a sizeable range of budget cases, they have proved that they can produce high quality top end cases like the original Thermaltake Level 10.

Today we are going to look at one of Thermaltake’s latest cases, the Armor A30, which boasts quite an impressive feature set for a small form factor case. It supports Micro ATX motherboards alongside a full size PSU, a couple of solid state drives and long graphics cards so is excellent for taking to LAN parties or for an exotic-looking HTPC.

Thermaltake announce the Overseer RX-I chassis

Neil Brett — Mon, 19 Sep 2011 13:38:16 +0000

Thermaltake have announced their new gaming chassis the Overseer RX-I the latest in their e-sports range in a full tower arrangement available from mid September.

The case features three 5.25 inch drive bays, one 3.5 inch bay, five internal 3.5/2.5 HDD bays and an external 3.5/2.5 HDD docking bay, the case comes with front intake fan 200 x 200m with the same size as a roof exhaust (room for a 2nd one), a rear 120 x 120mm exhaust and also has room for optional 200 x 200mm side intake and a further 120 x 120mm floor intake.

The case can take graphics cards with a length of up to 32cm (12.5 inches), the case also has support for internal USB 3.0 with two ports on the top of the case and features removable front, side and PSU dust filters as well as support for water cooling with external pass through holes.

The case also has a side window to show off the best of of your components and features what they describe as a breath lighting effect, and what has fast become the standard of bottom mounting for PSU.

Thermaltake announce Platinum and Gold series power supplies

Neil Brett — Fri, 09 Sep 2011 10:43:00 +0000

This month Thermaltake is to release its new Toughpower XT series Platinum and Gold series power supplies, aiming at enthusiasts and professionals offering highly powerful and efficient powerplants, the units are in three flavours 1275W Platinum, 1375W Gold and 1475W Gold, all with a modular cable design.

The power supplies have platinum and gold certification delivering up to 94% high power efficiency,the units are highly reliable and provide true wattage, featuring the Full Bridge and LLC resonance with DC-DC module and interleaved PFC circuit designs that provide a high reliability and efficiency, in addition 100% 105°C Japanese electrolytic and solid capacitors deliver an unbeatable stable power and performance whilst the machine is constantly consuming on high wattages in every environment.

The units have dual 12v rails which are able to support 4-way Sli and 4-way Crossfire, they also boast 3 LED light status indicator which display status for stand-by, good power signal and temperature (LED will go red if something is abnormal), the fan also has three modes of operation Fanless mode, Silent mode and Cooling mode which are controlled automatically adjusting fan mode and speed to create the smooth airflow and optimal thermal performance.

For a video overview click here, pricing not yet available.

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