An Asian analyst claims that Apple might adopt the Intel 18A-P manufacturing node for its upcoming ARM-based Apple M SoCs.
Intel 18A-P Technology and Its Benefits
The well-known analyst Ming-Chi Kuo reports that Apple plans to use Intel’s 18A-P process for some of its future low-end M chips, aimed at devices such as the MacBook and iPad. If true, this would be a major step forward for Intel’s Foundry Services division.
The Intel 18A node and its improved version, 18A-P, are at the forefront of semiconductor technology. The 18A-P process stands out for its enhanced voltage management, offering a better balance between power and efficiency. This aligns perfectly with Apple’s design approach, which focuses on achieving the best balance between performance and energy use.
Additionally, 18A-P is Intel’s first node compatible with Foveros Direct 3D hybrid bonding technology, allowing multiple chiplets to be stacked with a pitch of less than 5 microns.
Progress Toward Apple’s Partnership with Intel
Reports suggest that Apple has already made progress in the partnership. The company has signed an exclusive NDA and received version 0.9.1GA of the Process Design Kit (PDK) for the 18A-P node, with simulation results meeting expectations.
Apple is now waiting for the final version (PDK 1.0/1.1), expected in the first quarter of 2026.
If development continues as planned, Intel could start supplying Apple’s low-end M processors by the second or third quarter of 2027.
The move also fits Apple’s strategy to diversify its chip supply, reducing dependency on a single manufacturer and aligning with U.S. government goals to produce advanced chips within the country.
This potential adoption would represent a major opportunity for Intel, as Apple’s low-end M chips could require between 15 and 20 million units by 2027.
