TUF Gaming B550-Plus (Wi-Fi) distills essential elements of the latest AMD platform and combines them with game-ready features and proven durability. Engineered with military-grade components, an upgraded power solution and a comprehensive set of cooling options, this motherboard delivers rock-solid performance with unwavering gaming stability.
When you build with a TUF Gaming motherboard, you also benefit from the TUF Gaming Alliance — an ASUS collaboration with trusted industry partners that ensures easier building, best compatibility, and complementary aesthetics from components to case.
With upgraded power delivery and comprehensive cooling options to fuel the latest AMD Ryzen CPUs, plus support for faster memory and storage, TUF Gaming B550-Plus (Wi-Fi) is the perfect foundation for your next high-core-count battle rig.
The onboard VRM of TUF Gaming B550-Plus (Wi-Fi) utilises 8+2 DrMOS power stages that combine high-side and low-side MOSFETs and driver into a single package, delivering the power and efficiency that 3rd Gen AMD Ryzen™ Processors demand.
2-ounce copper layers draw heat away from critical components to keep them at their optimal operating temperatures and provide more headroom to push CPUs beyond stock speeds.
Compared with traditional power inputs, ProCool sockets are built to tight specifications to ensure flush contact with PSU power lines. The resulting lower impedance helps to prevent hotspots and connector failure.