Chinese VR-Zone put up a slide of Intel’s roadmap with states the 530 series will come during Q1 of 2013. According to the slide, there would be 180GB and 80GB models with 2.5″ and mSata form factors.
The Intel 530 series would probably replace Intel’s 510 series. The 530 series will use LSI SandForce’s SF-2281 just like the 525 series did. The only difference is that 530 series will be using a 20nm die shrink which will be released as an NGFF package- specifically keeping ultrabooks in mind.
The roadmap also shows that NGFF models will appear in Q1 2013 and will be more commonly available over the 2.5″ package. The dimensions of NGFF measure in at 42mm x 22mm versus the 51mm x 30mm of the 2.5″ form factor.
Via: Techspot
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