Intel Secures $3 Billion from U.S. Government for Secure Enclave Program

Intel has been awarded up to $3 billion in funding by the Biden-Harris administration under the CHIPS and Science Act to support the Secure Enclave program. This initiative aims to bolster the domestic manufacturing of leading-edge semiconductors for the U.S. government, strengthening the national technological infrastructure.

Intel’s involvement in the Secure Enclave program builds on previous partnerships with the U.S. Department of Defense (DoD), including the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) and the State-of-the-Art Heterogeneous Integration Prototype (SHIP) projects. As the only American company capable of both designing and manufacturing advanced logic chips, Intel is poised to reinforce the national semiconductor supply chain.

Strengthening U.S. Defense Technology

Chris George, president and general manager of Intel Federal, expressed pride in this collaboration:

Today’s announcement highlights our joint commitment with the U.S. government to fortify the domestic semiconductor supply chain and to ensure the United States maintains its leadership in advanced manufacturing, microelectronics systems, and process technology.

This funding is distinct from Intel’s previous agreement with the Biden-Harris administration in March to construct and modernize semiconductor facilities under the same CHIPS and Science Act.

Intel is also advancing its semiconductor manufacturing and research projects in Arizona, New Mexico, Ohio, and Oregon, with its cutting-edge Intel 18A technology expected to be ready for production by 2025.