Intel is speeding up work on its large chip factory in Ohio, United States, as it pushes forward with its plans to produce advanced chips. To help finish the project faster, the company has started offering workers generous overtime bonuses.
The factory covers more than 400 hectares and will play a key role in Intel’s “Angstrom” era. It is being built to support mass production of chips using the company’s 18A and 14A process technologies. Intel wants the facility to be ready for production of its next generation of advanced chips by 2031.
At the same time, Intel is making strong progress with its advanced chip packaging technology called EMIB-T (Embedded Multi-die Interconnect Bridge with Through-Silicon Vias). The company says production yields are now close to 90%, making EMIB-T a strong competitor to TSMC‘s CoWoS-L packaging technology.
Intel Speeds Up Ohio Factory Construction for Advanced Chip Packaging
EMIB-T uses vertical connections built directly into embedded silicon bridges inside an organic substrate. This allows chiplets to be stacked in three dimensions without the need for a full silicon interposer, which is much more expensive. As a result, Intel says EMIB-T can reduce costs by about 50% compared to similar solutions from TSMC. The company hopes to take full advantage of this by expanding its new facilities in Ohio.
Intel expects to begin offering EMIB-T packaging services on a large scale in 2027. The company believes this solution will appeal to processor and AI accelerator makers looking to lower costs while maintaining strong performance.
One challenge still remains. Manufacturing yields for the organic substrates supplied by partners such as Ibiden, Shinko, Unimicron, and AT&S are still around 50%. Despite this challenge, Intel’s suppliers are already working to improve production and meet future demand.
