Intel’s Future Chipsets to Incorporate WLAN and USB 3.1
John Williamson / 6 years ago
Intel’s latest processor range codenamed Kaby Lake isn’t a significant microarchitecture change and designed to slightly refine the current Skylake offerings. Of course, it’s not just about IPC improvements and the latest chipset could add a great deal of new functionality. According to the Taiwanese industry journal Digitimes, Intel is looking to implement Wi-Fi and USB 3.1 support in the upcoming 300-series motherboards, scheduled to be released at the end of 2017. The report states:
“The decision is expected impact existing third-party Wi-Fi and USB 3.1 chip makers including Broadcom, which is a major supplier of notebook WLAN chips, Realtek Semiconductor, a major supplier of desktop WLAN chips and ASMedia Technology, which has a major share in the USB 3.1 market.”
If true, this is an interesting move and I’m pleased to see USB 3.1 becoming a modern standard and embedded into the 300-series PCH. The Wi-Fi element I’m not overly concerned about but it could be handy for compact HTPCs or other media systems. As Kaby Lake’s release draws closer, more details should leak regarding the extra features and latest chipset. So far, we know that it will have native USB 3.1 support and users shouldn’t have to rely on third-party ASMedia controllers.
Are you looking forward to Kaby Lake and its successor?