InWin has just announced the launch of the COVALENT, a new full-tower chassis designed specifically for demanding professional environments, including high-performance computing and AI-driven workloads. Not that there’s anything stopping enthusiast PC gamers from enjoying it too, of course! This modular case design focuses on structural integrity and airflow efficiency to support users who require sustained performance from their hardware, as we all now, rendering and AI workloads make a lot of heat, so there’s a clear focus on massive airflow here.
The chassis is available in two distinct configurations to suit different aesthetic and functional needs. Users can select a tempered glass side panel to showcase high-end components and lighting, or opt for a solid metal panel that prioritises rigidity and noise reduction. The front panel features a vertical slot design, which is intended to maximise airflow intake for the internal components, not unlike the design of some of the recent-ish Fractal cases to my eyes, but still with enough of its own design elements to make it distinct.
COVALENT
The COVALENT is built to accommodate large-scale hardware configurations, including workstation-class components. So you’ll find space for EEB motherboards, which are the larger 12″ x 13″ models, while still support BTF designs too. There’s support for an incredible 13 fans, and up to two 420mm radiators, although you do get four 140mm fans pre-installed too.
Key features of the InWin COVALENT include:
- Compatibility with EEB (12 inch by 13 inch) and back-connect motherboards.
- Eight PCIe expansion slots supporting both horizontal and vertical GPU mounting.
- Reinforced steel construction with optional GPU support brackets for heavy-duty card stability.
- Expansive cooling support capable of housing up to two 420 mm radiators and thirteen fans.
- Includes four pre-installed CV140 fans (three front, one rear) for out-of-the-box airflow.
- Modular storage options for 3.5 inch and 2.5 inch drives.
- Dedicated power supply unit chamber to isolate heat.
- Modern front I/O featuring USB 3.2 Gen 2×2 Type-C connectivity.
- Tool-free panel design for easier maintenance and component access.
Where to Buy
At the time of writing, pricing and specific retail availability have not been announced. For further information and updates on the COVALENT release, please visit the official product page.
