LGA 2011 Stock Cooler Gets An Upgrade: Is The Core i7 5960X Going To Run Hotter?

Intel’s stock coolers may typically end up in most enthusiast’s bin, but for a lot of people they come in handy. Generally speaking they can deal with the CPU easily at stock, run quietly and are super-easy to install: if you want to get your system up and running quickly nothing quite beats them. With their new Haswell-E processors based on the LGA 2011-3 socket, the Core i7 5960X, 5930X and 5820K, Intel is shipping a new and improved stock cooler. The new stock cooler, TS13A, brings many improvements over the current LGA 2011 stock cooler, the RTS2011AC, these include:

• A taller heatsink design, 75mm vs 63mm
• An increased copper cooling area with added heat pipe
• Heatsink fins that are now curved for more heat dissipation area

The new design allows for a greater TDP capacity which suggests to us that the Core i7 5960X is going to run hotter than its predecessor the Core i7 4960X. That’s not really surprising given that the Core i7 5960X will have an extra two cores to deal with, there will obviously be more heat and a greater density to that heat. Whether the increased heat output leads to higher temperatures will be another interesting thing to see – we already know that Haswell-E still uses fluxless solder after it was recently delidded so temperatures won’t be anywhere near as disastrous as what we see on the Haswell LGA 1150 processors. As you may all recall the transition from Sandy Bridge to Ivy Bridge and from Ivy Bridge to Haswell on the mainstream platform all saw declining heat (aka TDPs) but increasing temperatures.

Source: Kitguru

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