It seems Sony has quietly introduced a major hardware upgrade to the cooling system of the new PS5 Slim models — an improvement that comes directly from the PS5 Pro design.
Reports indicate that the new PS5 Slim now includes an important hardware update to its liquid metal cooling system. This change was added silently by Sony and is derived from the PS5 Pro’s improved thermal management system.
The new setup aims to prevent leaks or spills of the liquid metal used for heat transfer, an issue that could sometimes appear in the original PS5 models and the first versions of the PS5 Slim.
In short, Sony has adopted the same solution used in the PS5 Pro, marking an important upgrade to how the console handles heat. This update comes through a redesign of certain hardware components.
Improved Placement of Liquid Metal
The new liquid metal thermal interface material (TIM) has been applied differently. The updated design includes visible grooves that securely hold the liquid metal in place.
Instead of appearing as a smooth surface, the liquid metal is now arranged in a pattern of rectangular layers, keeping it more firmly anchored in its compartment.
This new design appears in PS5 Slim models with codes CFI-2100 and CFI-2200. These models also feature improved heat sinks, which should further enhance internal temperature management.
Some have previously expressed concerns — for example, the founder of Alderon Games predicted that many PS5 units might fail within two years due to liquid metal issues. However, there is still no clear evidence showing how widespread these problems are.
What’s clear is that Sony continues to refine the cooling system. The newest PS5 Slim models have been specifically designed to reduce the risk of damage caused by the liquid metal used in the console’s heat dissipation system.
In other news, PlayStation 5 has reportedly reached 82.53 million units sold, surpassing the 82.52 million units of the PSP and the 82.51 million units of the Game Boy Advance.
