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TSMC Achieves 60% Yield in 2nm Manufacturing Process

TSMC

TSMC has achieved a 60% yield in its 2-nanometer manufacturing process, according to reports from local Taiwanese media. Yield refers to the efficiency of a manufacturing node, measured by the number of viable chips produced per wafer.

This figure is significantly higher than that of its main competitor, Samsung, which is currently achieving around 40% yield after a rocky start in the development of its 2nm process, initially struggling to surpass a 20% yield.

TSMC’s 2nm process uses GAA (Gate-All-Around) technology for the first time in the company’s history. This transition is expected to deliver up to 15% additional performance, while also reducing power consumption by about 30%, representing a major leap in chip efficiency and design.

Mass Production Timeline and Key Clients

The 60% yield refers to advanced chips such as CPUs and GPUs that are manufactured at the 2nm node, not merely memory components. In memory production, TSMC has reportedly achieved yields as high as 90%, although memory chips are generally simpler to produce.

Barring any surprises, AMD, NVIDIA, Qualcomm, Apple, and MediaTek, among others, are expected to be major clients for TSMC’s 2nm node. Both TSMC and Samsung plan to begin mass production of their 2nm chips in the second half of 2025.

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