TSMC is rolling out a lot of chips with the 28 nm process technology so quick that the Taiwan based chip maker not only will be able to easily meet the demands of existing orders, but also start manufacturing newer designs.
TSMC is also set to be increasing their manufacturing capacity to 68,000 300 mm wafer per month by the end of the year. This will be good news for those who rely on 3rd party wafer manufacturers such as Qualcom and Nvidia- maybe even for Apple?
As of now its making its fab 15/phase 2 to make 50,000 300 mm wafers a month. It is also said by Taiwan Economic news that TSMC is also constructing to make phase 3 and phase 4 fab 15 as well. Goes without saying that this will give a tremendous boost to the markets.
Source: Fudzilla
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