TSMC May Bring 2nm Manufacturing Node to the U.S. After 2025




/ 1 week ago
TSMC May Bring 2nm Manufacturing Node to the U.S. After 2025

According to Taiwan’s Minister of the Science and Technology Council, Wu Cheng-wen, TSMC may shift its next-generation 2-nanometer chip manufacturing process technology to other countries after 2025. This 2-nanometer process technology will compete with Intel’s 18A process, which is also due for production in 2025.

Shifting 2-Nanometer Technology to Other Countries

The Taiwanese government is said to be open to shifting this new technology to friendly nations once TSMC has started working on 2-nanometer successors (thanks Wccftech). The relationship between the United States and TSMC has become more complex following the CHIPS and Science Act passed by the U.S. administration. To date, TSMC has won $6.6 billion in U.S. funding to set up three manufacturing facilities in the United States.

For Wu, since TSMC will begin manufacturing 2-nanometer chips in Taiwan in 2025, the question of whether TSMC will be able to set up advanced facilities to make these chips in other countries will be addressed after large-scale production begins in Taiwan. His remarks suggest that, if discussions at the government level are fruitful, the firm could globally expand its 2-nanometer manufacturing footprint.

Taiwan’s Role in Semiconductor Research and Development

TSMC May Bring 2nm Manufacturing Node to the U.S. After 2025

Wu also emphasized that all advanced semiconductor research and development will remain in Taiwan. He clarified that while TSMC is encouraged to set up manufacturing facilities in the United States and other countries like Japan, these deals have not resulted in commitments to establish R&D centers outside of Taiwan.

Semiconductor fabrication remains a key aspect of Taiwan’s economy and national security, and TSMC is the most valuable firm on the Taiwan stock market. Wu also pointed out that despite TSMC’s global leadership in manufacturing the most advanced chips, the U.S. still leads in many areas of semiconductor fabrication, from design intellectual property to manufacturing materials.


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