TSMC Reportedly Starts Pilot Production of Its First 1.4nm Chips, Mass Production Planned for 2028
Taiwanese foundry TSMC has started the pilot production phase of its 1.4-nanometer lithography, internally known as the A14 process. This is according to industry sources in Taiwan.
Apparently, the first test wafers are being processed at the Hsinchu Science Park facilities and at Fab 25 in Taichung. This early stage is used to calibrate the machinery and check the facilities before committing full production lines.
A14 lithography will be the next major technical leap after the arrival of 2 nanometers, which is slowly spreading across the market. It will also follow the 1.6-nanometer A16 node.
TSMC Is Already Secretly Making Its First 1.4nm Chips
According to the foundry’s technical specifications, this advance will provide between 10% and 15% higher clock speeds while keeping the same power consumption. It could also reduce power use by between 25% and 30% when running at the same frequencies as the 2-nanometer process.
Although several reports pointed to possible large-scale trial production in the spring of 2027, TSMC’s official schedule places mass production in 2028. The company says that wafer yield is progressing ahead of its initial forecasts.
For 2029, TSMC plans to introduce the A13 node, which is expected to make chips 6% smaller while keeping the same design rules, making it easier for customers to move to the new process.
With the start of these tests, TSMC can breathe a little easier. In this way, the manufacturer protects its lead over competitors such as Intel and Samsung. It also secures a strong position in the supply of the most advanced chips for next-generation devices in the coming years.
