TSMC, the world’s largest contract chip manufacturer, has set an ambitious production target for its 2nm (N2) process. The company plans to increase its monthly N2 wafer production from the current 20,000 wafers to 100,000 wafers per month by the end of 2026.
This production increase marks a major step in TSMC’s roadmap. At the moment, the N2 process accounts for only 3% of the company’s total revenue, compared to 30% from the 3nm (N3) process and 33% from the 5nm (N5) process, which remains TSMC’s biggest source of revenue. If the company reaches its production target, the N2 process is expected to generate more than 10% of TSMC’s revenue before the end of 2026.
TSMC Plans Major Expansion for 2nm Wafer Production
Industry interest in the N2 process is already very high. According to TSMC, the N2 node has attracted four times more chip designs than the N3 process had at the same stage of its lifecycle. This strong demand is driven by the new Gate-All-Around Field-Effect Transistor (GAAFET) architecture, which can deliver up to 15% better performance at the same power level or reduce power consumption by 30% while maintaining the same performance.
Several major companies have already confirmed they will use the new process. Apple is expected to manufacture its A20 Pro chips for the future iPhone 18 Pro lineup using N2 technology, while AMD plans to use it for its EPYC “Venice” server processors.
Meanwhile, demand for TSMC’s 3nm process remains strong. Major customers including Nvidia, AMD, and Broadcom have increased monthly N3 wafer production to 180,000 units, exceeding the company’s original targets.
As the semiconductor industry moves toward the 2nm era, TSMC continues to strengthen its position in advanced chip manufacturing. These next-generation manufacturing technologies are expected to play an important role in future hardware for PCs, servers, and artificial intelligence systems.
