EK Innovates with New Direct-Die Cooling Solutions for Advanced CPUs




/ 2 weeks ago
EK Innovates with New Direct-Die Cooling Solutions for Advanced CPUs

EK has just introduced several cutting-edge direct die CPU water blocks for AMD’s Ryzen AM5 and Intel’s Core LGA 1700 processors. This move comes as modern CPUs like the Intel 14th Gen and AMD’s Ryzen 7000 series continue to generate higher temperatures.

Enhanced Cooling for Enthusiasts

Building on the success of its previous solutions for delidded Intel CPUs, EK has now launched its first All-In-One CPU cooler tailored for delidded chips from both Intel and AMD. This product has been met with considerable acclaim for its innovation and performance.

The new EK Direct Die solution for AMD’s Socket AM5 focuses on delivering top performance without the hassle of modifying existing setups. It features a specially designed cold plate and an optimized fin structure to direct cooling precisely over the chiplets.

Upcoming Solutions for Intel LGA1700 CPUs

EK Innovates with New Direct-Die Cooling Solutions for Advanced CPUs

EK is also preparing to launch a new water block for delidded Intel LGA1700 CPUs. This next-gen product improves upon its predecessors by featuring a new cold plate, fin design, and mounting system, ensuring optimal contact and pressure distribution over the CPU.

Recognizing some past issues with the Velocity² Direct Die model, EK offers free replacement parts for those affected. Customers unsatisfied even after these adjustments may request a full refund, demonstrating EK’s commitment to quality and customer service.

Special Discounts

To appreciate its loyal customers, EK is providing a 15% discount on the new Velocity² Direct Die Core and AMD Ryzen Editions to previous purchasers of the Velocity² Direct Die block. This discount is available through direct contact with EK Customer Support or affiliated retailers, depending on the purchase route.

These products will soon be available for order, with further details to be released in the coming days. This development marks a significant advancement in CPU cooling technology, catering to the demands of high-performance computing enthusiasts.


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