GIGABYTE Reveals New AORUS Z790 X Motherboards For Next-Gen Intel CPUs

Jakob Aylesbury / 8 months ago

GIGABYTE has today announced an expansion to its Z790 motherboard range with the introduction of four new AORUS Z790 X motherboards

New Z790 X AORUS Motherboards

These new Z790 X AORUS motherboards have been designed for the next generation of Intel processors using the Z790 platform. These new boards offer many improvements to cater to the next-generation CPUs with a focus on memory performance, BIOS advancements and hardware enhancements.

Improved DDR5 Support

Starting with the memory, these boards are now capable of running the latest in DDR5 performance with support for up to DDR5 XMP-8266 plus the DDR5 XMP Auto Booster enables effortless boosting from DDR5-5600 to 6000 with a single click. Additionally, the new Back Drilling Technology enhances the signal integrity for improved performance and reliability.

Innovative Quality of Life Features

GIGABYTE has implemented a variety of innovations designed to make the build process a lot easier. The M.2 EZ-Latch Click allows for screwless installation of the M.2 heatsinks as well as the PCIe EZ Latch offers easier detachment for graphics cards, very welcome with the newer and larger cards. The Z790 AORUS PRO X & AORUS ELITE X both offer a simplified Sensor Panel Link setup with a cable-routing-free installation, additionally, the Z790 AORUS XTREME X boasts a 5″ LCD Edge View display for real-time system information or other images.

BIOS Optimizations

The new UC BIOS features a redesigned UI and UX with Quick Access features with customizable option slots. PerfDrive technology is integrated with exclusive BIOS settings for an easy balance of performance, power consumption and temperature with Intel Core Processors. GIGABYTE has also partnered with HWiNFO for enhanced hardware information and accuracy, this collaboration has also introduced a GIGABYTE-themed skin for HWiNFO.

Ultra Durable and Efficient Thermal Designs

The new boards boast both ultra-durable technology for reliability and strength as well as a new thermal design for efficient heat dissipation. The Z790 X boards use a PCIe UD Slot X which is fastened to a dedicated backplate to increase the load-bearing capacity by 10 times for larger graphics cards. Additionally, an inner rubber strip protects the PCB from potential scratches. The thermal design of the board also aids in maintaining its reliability as the VRMs feature the Thermal Armor Fins-Array design with an increased heat dissipation area by up to 10 times. These heatsinks are enhanced with Nanocarbon Coating to optimize the thermal performance by 10%. The M.2’s are kept cool with the M.2 Thermal Guard on the XTREME and XL board variants which is ideal for the latest PCIe Gen 5 SSDs.