Thermaltake CTE C750 TG Air Case Review
Peter Donnell / 10 months ago
There’s rarely much innovation in the PC case market, at least, good innovation, there have been plenty of whacky design ideas that largely pan out to be nothing short of an inconvenience or some random aesthetic twist. However, Thermaltake is certainly doing things a little differently with its new CTE Form Factor. The case uses a 90-degree rotated motherboard design, which admittedly, we have seen before. However, the airflow design is very interesting. Air comes in from the relative front and the back of the case, as well as the bottom, and then exhausts out of the top. The aim here seems to be a heck of a lot more air in and more exhaust than you would typically find on a PC case… sounds pretty cool to me, literally!
As you can see from the specifications, the hardware support is borderline ridiculous, with up to 14 140mm fans you could likely make this case into a bloody hovercraft of sorts. Then still have plenty of room for pretty much any flagship gaming hardware too.
Features
- Up to E-ATX motherboards supported
- 12 x 2.5″ SSDs, 7 x 3.5″ HDD
- 14 x 120/140mm fans, 4 x 200mm fans (3 x 140mm fans included)
- Radiator Support
- Front Compatibility 1 x 360mm
- Top Compatibility 1 x 240mm
- Bottom Compatibility 1 x 360mm
- Rear Compatibility 1 x 360mm
- Side Compatibility 1 x 360mm
- 190mm tall CPU coolers
- 420mm GPU length
- 220mm PSU length
About the CTE
The CTE Form Factor Designed by Thermaltake, stands for Centralized Thermal Efficiency, and is focused around providing high level thermal performance to critical components. The design utilizes a 90-degree rotation of the motherboard providing more efficient airflow pathways. Since the CPU location has been moved much closer to the front panel and the graphics card moved closer towards the rear panel, independent cold air induction is given for thermal dissipation of the CPU and graphics card respectively. This overall approach has allowed CTE to provide better and more efficient intake airflow through the placement of main components and cooling, as well as optimization to heat extraction from the system.
